Microview Raises $13.6M to Fuel Chip Packaging Tech and Market Expansion
Microview, a Chinese leader in high-precision chip packaging equipment, has secured RMB 100 million (USD 13.6 million) in Series A+ funding. The company aims to use these funds to boost technology R&D and expand its market reach, as revealed by CEO Lei Weizhuang.
Founded in 2019, Microview has swiftly established itself in the domestic and international markets. It has collaborated with major clients to set up full-scale production lines using its own equipment, entering the American and European markets in the past three years. The company focuses on developing high-precision, high-speed, and stable die-bonding machinery using in-house core technologies.
Microview's rapid growth is driven by its experienced team, with over 60% of its workforce dedicated to R&D. The company has attracted investments from prominent firms like Sequoia Capital China and IDG Capital. With the recent funding round led by Haitong Capital, Microview plans to further its advancements in high-precision complex process technologies and expand into advanced packaging equipment.
Microview's success is also boosted by the surging demand for semiconductor packaging equipment in China, which is expected to reach RMB 300 billion (USD 41 billion) in 2022. With its sights set on becoming an industry leader, Microview is well-positioned to capitalize on emerging technologies like system-in-package (SiP) and 3D packaging, promising a future of innovation and growth.
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